RFP for deployment linked incentive for design, development, manufacture, validation and deployment of two types of secure systems on chips (SoCs) using Indian owned processor based on open source ISA

Tender Information at Central Public Procurement Portal
Tender Reference Number	MeitY/SoC/DLI/01/2022-2023
Tender ID	2022_DEIT_677107_1
Date of Release of Tender	Wednesday, September 7, 2022
Clarification period Clarifications may be sent to swadeshi[dot]processor[at]meity[dot]gov[dot]in	September 7, 2022 to September 28, 2022
Pre Bid Meeting Date	02:30PM, October 12, 2022 at Ministry of Electronics and Information Technology Electronics Niketan, 6, CGO Complex New Delhi- 110003
Bid Submission Period	November 2, 2022 to November 23, 2022

Corrigendum-1: The Bid Submission period has been postponed by 03 weeks (i.e. November 23, 2022 to December 14, 2022) vide following Corrigendum dated November 01, 2022.

Corrigendum-1446.33 KB

Pre-bid queries and clarification to the RFP: Following is the clarifications to the Pre-bid queries.

Pre-bid queries and clarification to the RFP168.41 KB

Corrigendum-II: Following Corrigendum dated November 22, 2022 is issued based on the Pre-bid meeting.

Corrigendum-II704.64 KB

Corrigendum-III: The Last Date (Deadline) for submission of Bids is extended up to 11th January 2023 at 15:00 PM

Corrigendum-III251.49 KB

Tender Document1.52 MB

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RFP for deployment linked incentive for design, development, manufacture, validation and deployment of two types of secure systems on chips (SoCs) using Indian owned processor based on open source ISA